Want to know more about how our analysis methods can support your research in electronic engineering and semiconductor materials? Whether you’re a student, a researcher, or a professor, we’ve put together some relevant application examples of our solutions in semiconductor research and device processing.
The materials and analytical equipment used in these examples overlap with Materials Science and Engineering, and Physics and Applied Physics, so you may find additional information on those pages. Method abbreviations are explained at the bottom of this page.
Semiconductor research
Our applications in semiconductor research primarily involve high resolution X-ray Diffraction of epitaxial layers. Thin film growth by MBE, MOCVD or CVD are big research areas in Electronic Engineering and Physics departments. This is where we find the highest concentration of our High-Resolution XRD applications. There is a constant quest to develop new semiconductor materials and to overcome the many challenges of incorporating new materials into working devices. The table below provides a selection of application notes that exemplify typical measurements on semiconductor materials. Click on any of the links in the table to discover more!
Semiconductors Research | Method | Sample | Application Note Title (Link) |
---|---|---|---|
Epitaxial layers - finding reflections | HR-XRD | GaN / InGaN alloys | Available reflections for coplanar and in-plane XRD of GaN and related alloys |
Epitaxial layers - rapid measurements | HR-XRD | InGaN/GaN multiple quantum wells | Fast X-ray diffraction measurements on semiconductor structures |
Epitaxial layers - thermal stability | HR-XRD | AlInN/GaN/Sapphire | Studying the thermal stability of gallium nitride based high electron mobility transistor structures |
Epitaxial layers – strain, composition, and layer thickness | HR-XRD | Gallium Nitride and related compounds | XRD of gallium nitride and related compounds: strain, composition and layer thickness (booklet) |
Epitaxial layers - strain, composition, and layer thickness | HR-XRD | GaAs on Ge on Si | Semiconductor thin films. Analysis of III-V solar cells on silicon substrates |
Narrow bandgap (IR) semiconductors - film composition, thickness | XRF | InxSy films on glass | |
OLED polymers - molecular weight | GPC | Poly(phenylene-vinylene) (PPV) in Chloroform; 2) poly(fluorene-phenylenevinylene)(PF-PPV) in THF; 3) polythiophene (PT) in Chloroform | |
Perovskite semiconductors - defects | Reflection Topography | Perovskite LiTaO3 | |
Phase change materials - crystalline phase identification | XRD / XRR | Germanium Antimony Telluride (Ge2Sb2Te5) PCM | Combining XRR & XRD for in-situ investigation of phase change materials |
Thin films - In-plane methods | XRD / HR-XRD | Co films in hard disks, GaN on Sapphire | |
Thin-film solar cells - overview | XRD / HR-XRD | Solar cell materials, general | X-ray diffraction techniques for characterization of thin film solar cells |
Wide bandgap (UV) semiconductors - thin film quality | XRD / XRR | ZnO films on glass |
Device processing
Malvern Panalytical’s wafer analyzer is not often employed in university research, but it is worth showing here some of the process fabrication instances where it is employed to measure elemental composition and film thickness. Wafer cutting and polishing is also an important step in device processing and particle size characterization is important to control the quality of cutting and polishing slurries. Click on any of the links in the table to discover more!
Device Processing | Method | Sample | Application Note Title (Link) |
---|---|---|---|
Dielectric films - composition, thickness | XRF | Borophosphosilicate glass (BPSG) Dielectric films, Boron, phosphorous, Silicon | |
Diffusion barrier layers - composition, thickness | XRF | Cu/TaNx multilayers on Si wafers | |
Diffusion/bonding metallization - composition thickness | XRF | TiNx layers on Si wafers | |
Epitaxial layers -composition | XRF | Ge concentration in Si(1-x)Gex films | |
Ferroelectric/Dielectric films - composition, thickness | XRF | Barium Strontium Titanate (BST) films on Pt | |
Gate connecting layers - thickness | XRF | Tungsten (W) layers | |
Gate technology - layer thickness | XRF | WSix deposition on Silicon | |
Giant magnetoresistant multilayers - composition, thickness | XRF | Ta, NiMn, PtMn, CoFe, Cu, NiFe, Al2O3 thin films | Analysis of Giant Magneto Resistance GMR film stacks using X-ray fluorescence spectrometry |
Interconnect layers- composition, thickness | XRF | AlCu interconnect layers on S substrate | |
Passivation layers - thickness | XRF | Ni-Ta thin films on Si | |
Read/write heads for hard drives - layer thickness | XRF | CoNiFe films on hard drives | In-line process control of CoNiFe layers in the manufacturing of read/write heads |
Wafer cutting slurry - particle size and shape | Imaging | Silicon carbide - abrasive slurry | |
Wafer polishing slurry – particle size | ELS / DLS | Silica-based particles in ammonia salt solution, silica-based particles in KOH solution | Characterization of SiO2 Slurry Samples Used in Chemical Mechanical Polishing |
Wafer polishing slurry - zeta potential | ELS | SiO2 or Al2O3 particles | Zeta Potential Measurement of Highly Concentrated CMP Slurry Dispersions |
약어 설명
당사의 제품 및 기술은 제품 페이지에 설명되어 있습니다. 아래에서 측정 이름 및 약어와 함께 당사 기기로 측정한 특성에 대한 빠른 참조를 찾을 수 있습니다. 자세한 내용을 보려면 각 방법을 클릭하십시오!
약어 |
방법 이름 |
기기 |
측정된 특성 |
---|---|---|---|
DLS |
Zetasizer |
분자 크기, 유체역학적 반경 RH, 입자 크기, 크기 분포, 안정성, 농도, 응집 |
|
ELS |
Zetasizer |
제타 전위, 입자 전하, 현탁액 안정성, 단백질 이동도 |
|
ITC |
MicroCal ITC |
결합 친화도, 용액 내 분자 반응의 열역학 |
|
DSC |
Microcal DSC |
대형 분자의 변성(풀림), 거대분자의 안정성 |
|
GCI |
Creoptix WAVEsystem |
실시간 결합 동역학 및 결합 친화도, 유체를 사용한 무표지 |
|
IMG |
Morphologi 4
|
입자 영상 처리, 자동 형상 및 크기 측정
|
|
MDRS |
Morphologi 4-ID |
입자 영상 처리, 자동 형상 및 크기 측정, 화학적 식별 및 오염물 검출 |
|
LD |
Mastersizer Spraytec Insitec Parsum |
입자 크기, 크기 분포 |
|
NTA |
NanoSight |
입자 크기, 크기 분포 및 농도 |
|
SEC 또는 GPC |
OMNISEC |
분자 크기, 분자량, 올리고머 상태, 폴리머 또는 단백질 크기 및 분자 구조 |
|
SPE |
Le Neo LeDoser Eagon 2 OxAdvanced M4 rFusion |
XRF를 위한 용융 비드 샘플 전처리, ICP를 위한 과산화물 용액 전처리, 비드 만들기를 위한 플럭스 칭량 |
|
UV/Vis/NIR/ SWIR |
LabSpec FieldSpec TerraSpec QualitySpec |
물질 식별 및 분석, 수분, 광물, 탄소 함량. 공기중 및 위성 분광 기법을 위한 지상 실측. |
|
PFTNA |
CNA |
인라인 원소 분석 |
|
XRD-C |
Aeris Empyrean |
분자 결정 구조 정제, 결정상 식별 및 정량화, 결정질 대 비결정질 비율, 결정질 크기 분석 |
|
XRD-M |
Empyrean X’Pert3 MRD(XL) |
잔류 응력, 텍스처 |
|
XRD-CT |
Empyrean |
고체, 다공성 및 밀도의 3D 영상 처리 |
|
SAXS |
Empyrean |
나노입자, 크기, 형태 및 구조 |
|
GISAXS |
Empyrean |
나노구조의 박막 및 표면 |
|
HR-XRD |
Empyrean X’Pert3 MRD(XL) |
박막 및 에피택시 다층, 조성, 변형, 두께, 품질 |
|
XRR |
Empyrean X’Pert3 MRD(XL) |
박막 및 표면, 막 두께, 표면 및 계면 조도 |
|
XRF |
Epsilon Zetium Axios FAST 2830 ZT |
원소 조성, 원소 농도, 미량 원소, 오염물 검출 |