Crystal orientation range

Fast and accurate orientation of wafers, boules and any other single crystalline samples

Download brochure

A crystal is a repeating pattern of atoms which means that what we see from the point-of-view of an electron/photon going into this crystal, will depend on the angle we are looking into this crystal. The view could be a channel pointing all the way through the crystal or just the top three layers of the material, therefore the material properties can be quite different depending on the angle. A good control of the material properties requires a good control of the crystal orientation.

It is an important process in ion implantation, lithography, epitaxy but also for example when making a laser or optical components.

The Crystal Orientation range is based on Azimuthal scan, a smart geometrical measurement technique to orient the crystal. That means that we can find not only the tilt of the main axis, but also all in-plain directions in as fast as 10 seconds. The instruments can measure almost any shape as long as it is a single crystal, such as wafers, ingots, boules, pucks etc.

Well designed for industrial applications such as single crystal or wafer manufacturers, research purposes but also for quality control of the wafers and other devices, 

Our highly precise Crystal Orientation systems offer simple and quick crystal orientation measurements, ensuring the desired properties are there for the next processing steps.

DDCOM

Ultra-fast, bottom surface measuring crystal orientation in a compact package

Features include

  • Benchtop device
  • Higher throughput due to no height alignment
DDCOM

SDCOM

Ultra-fast, flexible, top surface measuring crystal orientation in a compact package

Features include

  • Benchtop device
  • Outstanding accuracy, fit for samples from 2 mm² up to 300 mm Ø wafers
SDCOM

Omega/Theta

Fully automated vertical three-axis X-ray diffractometer for ultra-fast crystal orientation

Features include

  • As fast as 10 seconds per full crystal measurement
  • Higher throughput and outstanding accuracy compared to conventional systems
  • Flexible with accessories for marking, mapping, alignments for transfers of all single crystalline materials
Omega/Theta

Wafer XRD 200

Fast, precise and fully equipped solution for wafer orientation and sorting

Features include

  • High capacity wafer metrology; full cassette of 25 wafers measured in less than 10 minutes
  • Optimal for Wafer Production: measure crystal orientation, recognize wafer ID, flat/notch and shape of wafer edge
Wafer XRD 200

Wafer XRD 300

Integratable wafer orientation solution

Features include

  • High throughput wafer metrology system
  • Supports 300mm Si wafers
  • Optimal for Wafer Production: measure crystal orientation, recognize wafer ID, flat/notch and shape of wafer edge
Wafer XRD 300

XRD-OEM

Fully automated in-line orientation and handling of ingots, boules, and pucks

Features include

  • Measurement head for crystal orientation
  • Built for integration into e.g. cutting and grinding machines
XRD-OEM
DDCOM

DDCOM

Ultra-fast, bottom surface measuring crystal orientation in a compact package

SDCOM

SDCOM

Ultra-fast, top surface measuring crystal orientation in a compact package

Omega/Theta

Omega/Theta

Fully automated vertical three-axes X-ray diffractometer for ultra-fast crystal orientation

Wafer XRD 200

Wafer XRD 200

Fast, precise and fully equipped solution for wafer orientation and sorting

Wafer XRD 300

Wafer XRD 300

Your integratable wafer orientation solution

XRD-OEM

XRD-OEM

Fully automated in-line orientation and handling of ingots, boules, and pucks

Technology
X-ray Diffraction (XRD)
Crystal orientation
System type
System type Benchtop Benchtop Floor standing Floor standing Floor standing Measurement head
Stages
Mapping stage N/A
Grinding stage N/A
Stacking stage N/A
Tube settings
Tube power 30kV / 1mA 30kV / 1mA 30kV / 10mA 30kV / 1mA 30kV / 1mA 30kV / 1mA
Cooling system Air cooling Air cooling Water cooling Air cooling Air cooling Air cooling
Features
Marking *Basic N/A
Optical Geometry Recognition Optional for Boules Optional for Boules Coming soon
Rocking curves (crystal quality of the sample) N/A
Theta Scans (for orientation with basic optics only) N/A
Specifications
Throughput speed 10+ seconds Height alignment + 10 seconds Height alignment + 10 seconds 10 minutes for 25 wafers -- Depending on the machine