2830 ZT

Advanced semiconductor thin film metrology solution

The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.

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Features

Continuous capability and speed

The 4 kW SST-mAX X-ray tube features groundbreaking ZETA technology which drastically reduces the effects of X-ray tube aging. This ‘new tube’ performance is maintained throughout the tube’s lifetime, and together with high sensitivity, ZETA technology ensures that rapid analysis and short measurement times are upheld throughout the tube’s lifetime. ZETA technology robustly reduces the need for drift correction and recalibration, which increases productivity and uptime of the instrument.

Maximized uptime

Conventional X-ray tubes suffer tungsten evaporation, which causes deposits on the inside of the tube’s beryllium window. Instrumentation using such X-ray tubes requires regular drift correction to compensate for decreasing intensity, especially for light elements. 

Implementation of the SST-mAX Tube in the 2830 ZT solves this drift problem, thereby maximizing uptime and maintaining instrument precision over time.

Easy to use

The 2830 ZT is supplied with the advanced SuperQ software, which includes FP Multi, the software package specifically designed for multi-layer analysis. The software’s user interface ensures that even inexperienced operators can carry out fully automated fundamental parameter analysis of multi-layers.
The instrument's SuperQ software has a wide range of easy-to-use modules designed for flexible operation by researchers and engineers. Switching between recipes is easy, as is adjusting equipment parameters to suit user preferences.

FALMO-2G

The FALMO-2G easily integrates into any lab or fab: from simple manual carrier loading to full automation. A fully flexible design enables the fab manager to choose from FOUP, SMIF or open cassette load ports, with either a single or dual load port configuration. The various configurations FALMO-2G are all supported by GEM300 compliant software. The footprint of the FALMO-2G has been minimized without compromising flexibility, functionality 

Applications

Flexible operation

The instrument's SuperQ software has a wide range of easy-to-use modules designed for flexible operation by researchers and engineers. Switching between recipes is easy, as is adjusting equipment parameters to suit user preferences.

Specification

Sample handling X-ray tube Channels Installation
Wafers of 100 - 300 mm by direct loading; smaller sizes can be handled by special adapters SST-mAX75, tapered nose, end-window tube, SST-mAX50  an option Up to 24 fixed channels SEMI S2/S8 compliant
FOUP, SMIF, open cassette and manual loading options available Measurement spot size 40 and 10 mm; other spot sizes possible Max. 2 goniometers Full SECS/GEM compliant
Troughput up to 25 wafers per hour Zeta Technology Ultra-high performance Boron channel  for highest sensitivity and throughput
Special high performance channles for high sensitivty and high thorughput available for B, C, N, O, F, Mg, Wsix, TiSix, CoSix
Non-inflammable argon/methane
Flow counter


Sealed counter



Scanner 10 º-100 º 2θ



Scintillation with 300 μm Be window

Software

DifferAction

DifferAction is an optional extension for our Wafer Analyzer 2830 ZT spectrometer platform with SuperQ software, which enables automatic wafer angle optimization for more accurate XRF analysis.

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DifferAction

ToolMatch

By calculating the regression of systematic differences in semiconductor analysis, this software enables automatic results tuning, based on the ToolMatch correction between Wafer Analyzers.

It is the ideal solution for ensuring consistent results both within and across sites.

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ToolMatch

Services

Services

XRF testing services

Malvern Panalytical offers a range of analytical services, ranging from elemental, structural and morphological analysis to validation and qualification services.

XRF testing services

Support

Support services 

  • Phone and remote support
  • Preventive maintenance and checkups
  • Flexible Customer Care Agreements
  • Performance certificates
  • Hardware and software upgrades
  • Local and global support

Expertise

  • Turnkey solutions for elemental and structural semiconductor metrology
  • Automation and consultancy
  • Training and education
Ultimate capability for film and wafer analysis.

Ultimate capability for film and wafer analysis.

Advance your wafer analysis with continuous capability and easy-to-use software modules, packaged up in a user-friendly instrument.

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