The 2830 ZT wavelength dispersive X-ray fluorescence (WDXRF) wafer analyzer offers the ultimate capability for measuring film thickness and composition. Designed specifically for the semiconductor and data storage industry, the 2830 ZT Wafer Analyzer enables the determination of layer composition, thickness, dopant levels and surface uniformity for a wide range of wafers up to 300 mm.
Download brochureThe 4 kW SST-mAX X-ray tube features groundbreaking ZETA technology which drastically reduces the effects of X-ray tube aging. This ‘new tube’ performance is maintained throughout the tube’s lifetime, and together with high sensitivity, ZETA technology ensures that rapid analysis and short measurement times are upheld throughout the tube’s lifetime. ZETA technology robustly reduces the need for drift correction and recalibration, which increases productivity and uptime of the instrument.
Conventional X-ray tubes suffer tungsten evaporation, which causes deposits on the inside of the tube’s beryllium window. Instrumentation using such X-ray tubes requires regular drift correction to compensate for decreasing intensity, especially for light elements.
Implementation of the SST-mAX Tube in the 2830 ZT solves this drift problem, thereby maximizing uptime and maintaining instrument precision over time.
The 2830 ZT is supplied with the advanced SuperQ software, which includes FP Multi, the software package specifically designed for multi-layer analysis. The software’s user interface ensures that even inexperienced operators can carry out fully automated fundamental parameter analysis of multi-layers.
The instrument's SuperQ software has a wide range of easy-to-use modules designed for flexible operation by researchers and engineers. Switching between recipes is easy, as is adjusting equipment parameters to suit user preferences.
The FALMO-2G easily integrates into any lab or fab: from simple manual carrier loading to full automation. A fully flexible design enables the fab manager to choose from FOUP, SMIF or open cassette load ports, with either a single or dual load port configuration. The various configurations FALMO-2G are all supported by GEM300 compliant software. The footprint of the FALMO-2G has been minimized without compromising flexibility, functionality
The instrument's SuperQ software has a wide range of easy-to-use modules designed for flexible operation by researchers and engineers. Switching between recipes is easy, as is adjusting equipment parameters to suit user preferences.
| Sample size | Wafers of 100 - 300 mm by direct loading; smaller sizes can be handled by special adapters |
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| Sample types | FOUP, SMIF, open cassette and manual loading options available |
| Throughput | Throughput up to 25 wafers per hour |
| System compatibility | SST-mAX75, tapered nose, end-window tube, SST-mAX50 as an option |
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| Measurement size range | Measurement spot size 40 and 10 mm; other spot sizes possible |
| Technology | Zeta Technology |
| Channels | Up to 24 fixed channels
Max. 2 goniometers Ultra-high performance Boron channel for highest sensitivity and throughput Special high performance channels for high sensitivity and high throughput available for B, C, N, O, F, Mg, Wsix, TiSix, CoSix Non-inflammable argon/methane Flow counter Sealed counter Scanner 10 º-100 º 2θ
Scintillation with 300 μm Be window
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| Regulatory testing | SEMI S2/S8 compliant
Full SECS/GEM compliant
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Accessories available with the 2830 ZT are listed below.
We also offer a range of analytical services, from elemental, structural and morphological analysis to validation and qualification services. Find out more about XRF testing services here.
DifferAction is an optional extension for our Wafer Analyzer 2830 ZT spectrometer platform with SuperQ software, which enables automatic wafer angle optimization for more accurate XRF analysis.
As an additional package for our Wafer Analyzer 2830 ZT platform with SuperQ software, ToolMatch makes consistent results across your equipment simple.
By calculating the regression of systematic differences in semiconductor analysis, this software enables automatic results tuning, based on the ToolMatch correction between Wafer Analyzers. It is the ideal solution for ensuring consistent results both within and across sites.
Version number: 4
Version number: 4
Version number: 2
Please contact support for the latest software version.
Advance your wafer analysis with continuous capability and easy-to-use software modules, packaged up in a user-friendly instrument.
