Non-ambient chambers

Complete solution for in situ X-ray analysis

In situ X-ray analysis, often referred to as analysis at non-ambient conditions, is one of the key applications for advanced material research in both academic and industrial environments.

Material property analysis

Any macroscopic property of a material is directly related to its structural property (e.g. crystallographic symmetry, crystallite size, vacancies, size and shape of nanoparticles or pores). Temperature, pressure, varying gas atmosphere and mechanical stress trigger phase transformation, chemical reactions, recrystallization and so on.

X-ray diffraction (XRD) and X-ray scattering techniques are the first and sometimes the only choice for the correct and accurate in situ characterization of these changes. Whether it is for optimization of a manufacturing process or tuning of a synthesis procedure, or for state-of-the-art research and creation of new materials, in situ X-ray analysis is the most comprehensive tool for problem solving.

Download the leaflet for an overview of our non ambient attachments and their field of application.

Explore our range of non-ambient chambers

HTK 1200N – oven heater

For powder XRD in transmission and reflection geometry, basic stress, SAXS, PDF and thin film analyses at temperatures to 1200 ºC.
HTK 1200N – oven heater

TTK 600 – low temperature chamber

For powder XRD in reflection and transmission, basic stress and thin film analysis in the temperature range -190 °C to +600 °C.
TTK 600 – low temperature chamber

PheniX – low temperature cryostat

For powder XRD in reflection, basic stress and thin film analysis in the temperature range from - 261 °C (12 K) to + 25 °C (298 K).
PheniX – low temperature cryostat

Cryostream Plus compact

For powder XRD, basic SAXS and PDF in capillary geometry in the temperature range from -193 ºC (80 K) to 227 ºC (500 K).
Cryostream Plus compact

XRK 900 – reactor chamber

For powder XRD in reflection, basic stress and thin film analysis at temperatures to 900 ºC and pressures to 10 bars with various gases.
XRK 900 – reactor chamber

DCS 500 – domed cooling stage

For advanced thin film analysis and stress measurements at temperatures from -180 ºC to 500 ºC.
DCS 500 – domed cooling stage

DHS 1100 – domed hot stage

For advanced thin film analysis, stress, texture and basic powder XRD in reflection at temperatures to 1100 ºC.
DHS 1100 – domed hot stage

BTS 150/500 – benchtop heating stages

Anton Paar BTS 150 and BTS 500 benchtop heating stages, a low cost solution for in situ XRD (-10 °C to +500 °C).
BTS 150/500 – benchtop heating stages